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Example research essay topic: Figure 2 Figure 4 - 1,075 words

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... tests, including vibration, impact, and fiber retention, were performed to evaluate the strength of the bonds between the glass solder and the optical fibers and the substrate. For the fiber retention tests, standard singlemode fibers were secured to silica substrates with a small (- 2 mm diameter) bead of glass solder using the process described above. Tensile forces were then applied to the fiber leads by attaching weights of known mass. All five samples in this study were able to support tensile loads in excess of 5 kgf (49 N) without failure of the glass solder bonds. By comparison, similar samples prepared using epoxies typically failed at substantially lower pull-out forces.

Couplers packaged using the Glassoldertm technique proved to be quite robust when tested for both vibration and impact. The vibration tests were conducted over the frequency range of 10 Hz to 55 Hz, in accordance with the test conditions specified in Bellcore TR-NWT- 001209. The samples were subjected to simple harmonic motion amplitude of 1. 52 mm (0. 060 ") for a period of two hours of three mutually perpendicular axes. The average change in insertion loss following the vibration test was only - 0. 1 dB. During the impact tests, conducted from a height of 1. 8 meters, each coupler was dropped eight times along each of three mutually perpendicular axes.

The components were packed in a container with sand in order to fully transmit the shock of the impact throughout the coupler package. The average change in insertion loss following the impact tests was only - 0. 1 dB. Figure 2. Long term damp heat test (85 C/ 85 %RH) for couplers with epoxy alone and with the addition of the glass solder. Note that, to further accelerate the effects of the hot, humid environment, the test was conducted with an open substrate, ie. , without the tube and boots shown in figure 1. In order to test the thermal compatibility of the glass solder with silica fibers and substrates, seventeen fully packaged couplers were subjected to temperature cycle tests between - 40 oC and 125 oC.

Each coupler was tested for five temperature cycles and actively monitored throughout the test. The couplers exhibited minimal sensitivity to changes in temperature. Furthermore, only two of the couplers exhibited changes in insertion loss of more than 0. 2 dB. In an effort to evaluate the ability of the glass solder to withstand prolonged exposure to hot, humid environments, ten partially packaged couplers were subjected to an 85 oC/ 85 %RH damp heat environment for approximately 2, 500 hours.

In order to accelerate the detrimental effects of humidity, the couplers were secured to silica substrates using the glass solder and inserted directly into an environmental chamber. The couplers were not housed inside a protective tube or sealed from the humidity in any way. Figure 3. The maximum peak to peak change in the insertion loss during the Bellcore TR-NWT- 001209 temperature cycle test is shown for two groups of couplers. Those couplers packaged with the Glassoldertm process generally showed a smaller change and were more consistent than those couplers packaged only with epoxy. A second group of five couplers, packaged in a similar manner using only an epoxy, was also included in the test for comparison.

Both sets of couplers were monitored periodically during the test. The typical performance of the exposed couplers during the damp heat test is shown in figure 2. After approximately 600 hours of test time, the humidity began to weaken and breakdown the epoxy, causing the insertion loss of the epoxy-packaged couplers to change substantially. In comparison, no significant degradation in the performance of the Glassoldertm couplers was observed. Further more, while the behavior of the epoxy-packaged couplers was completely unpredictable, all of the couplers assembled using the glass solder behaved in the manner shown in figure 2. It is interesting to note that the insertion loss of the coupled leg of the Glassoldertm couplers slowly decreased during the test, indicating a slight increase in coupling ratio.

We believe that this was due to the diffusion of moisture into the glass fibers of the coupling region which was completely unprotected from the hot, humid environment. To evaluate this hypothesis, the above test was continued beyond 2, 500 hours without the high humidity. As expected, their insertion loss returned to its original value within a short time. Qualification Tests A number of couplers were built for qualification testing in accordance with the test criteria specified in Bellcore TR-NWT- 001209. Three different groups of couplers were assembled: dual window (1310 / 1550 nm) 50 / 50 couplers in the Glas Solder TM package, 10 % tap couplers in the Glas Solder TM package and 10 % tap couplers in an epoxy package. In order to compare the performance of the two packaging processes the 10 % tap couplers were built using both the epoxy and glass solder.

Despite the fact that these qualification tests are relatively short term, the Glassoldertm packaged tap couplers showed superior performance in every test category. As one example, figure 3 shows the results obtained for the temperature cycle test for both the epoxy package and the Glas Solder TM package. Not only were the changes with the Glassoldertm package in general, smaller, but the results for the entire lot showed greater consistency. Figure 4.

The average peak to peak change in the insertion loss during the entire sequence of Bellcore TR-NWT- 001209 tests are shown for two groups of couplers, i. e. , 10 % taps with and without the glass solder. While both groups performed well, a direct comparison between the two groups of tap couplers shows that the glass solder package out performed the epoxy package in every category. The average peak-to-peak change in the insertion loss for the 10 % tap couplers, with and without glass solder, for all of the tests are shown in figure 4.

While both package types performed well, the Glassoldertm package clearly outperformed the epoxy package. Gould's components are available now with the Glas Solder TM package in prototype quantities. To find out more about the Glassoldertm package call a Gould sales engineer at 1 - 800 - 544 - 6853. Figure 5. Peak to peak insertion loss for a group of 50 / 50 wavelength independent couplers packaged with the Glas Solder TM technique which underwent the Bellcore TR-NWT- 001209 test criteria.

Bibliography: webster dictionary p. 13


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